HONGKE HAODI TECHNOLOGY CO.,LTD
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Place of Origin: | Zhejiang, China (Mainland) |
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Quotation required:
1) Gerber file / PCB file & Bom list
2) Clear pictures of pcb/ fpc/ pcba or pcba sample for us
3) The PCB specification: base material, board thickness, copper thickness, surface finishing, gold immersion thickness, and any other special requirements.
4) Test method for PCB/PCBA
PCB Specification:
Files | Gerber, Protel, Powerpcb, Autocad, Cam350, etc | |
Material | FR-4, Hi-Tg FR-4, Lead free Materials (RoHS Compliant) , CEM-3, CEM-1, FR1, Aluminium, High frequency Material (Rogers, Teflon, Taconic) | |
Layer No. | 1 - 30 Layers | |
Board thickness | 0.0075"(0.2mm)-0.125"(3.2mm) | |
Board Thickness Tolerance | ±10% | |
Copper thickness | 0.5OZ - 4OZ | |
Impedance Control | ±10% | |
Warpage | 0.075%-1.5% | |
Peelable | 0.012"(0.3mm)-0.02’(0.5mm) | |
Min Trace Width (a) | 0.005"(0.125mm) | |
Min Space Width (b) | 0.005"(0.125mm) | |
Min Annular Ring | 0.005"(0.125mm) | |
SMD Pitch (a) | 0.012"(0.3mm) | |
pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b) | 0.027"(0.675mm) | |
Regesiter torlerance | 0.05mm | |
Min Solder Mask Dam (a) | 0.005"(0.125mm) | |
Soldermask Clearance (b) | 0.005"(0.125mm) | |
Min SMT Pad spacing (c) | 0.004"(0.1mm) | |
Solder Mask Thickness | 0.0007"(0.018mm) | |
Hole size | 0.01"(0.25mm)-- 0.257"(6.5mm) | |
Hole Size Tol (+/-) | ±0.003"(±0.0762mm) | |
Aspect Ratio | 6:01 | |
Hole Registration | 0.004"(0.1mm) | |
HASL | 2.5um | |
Lead free HASL | 2.5um | |
Immersion Gold | Nickel 3-7um Au:1-3u'' | |
OSP | 0.2-0.5um | |
Panel Outline Tol (+/-) |
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